Medicept Bond Plus Se (Self Etch Bonding Adhesive)

• Ture one-step application
• No mixing or shaking needed
• Quick and easy to use
• Excellent bond strength
• Hema-free composition only a very thin layer required
• Reusable application dish
• Micro applicators included

Medicept Bond Plus Se (Self Etch Bonding Adhesive) is a state-of-the-art dental adhesive that offers simplified and efficient bonding in dental procedures. This single-component adhesive is designed based on proven ethanol/water solvent technology, providing total etch capability with reduced technique sensitivity. One of the key advantages of Medicept Bond Plus Se is its versatility, allowing for both wet and dry bonding applications. This makes it suitable for a wide range of direct and indirect dental procedures. The adhesive is filler loaded, which contributes to reduced micro-leakage and film thickness, while simultaneously increasing bond strength for reliable and long-lasting results.

With its user-friendly design, Bond Plus Se offers ultimate simplicity of use by combining etching, priming, and bonding into a single application. This saves valuable chairside time, allowing for more efficient treatment. The adhesive has been clinically proven to be reliable, ensuring consistent performance in various clinical situations.

Furthermore, Medicept Bond Plus Se demonstrates reduced post-operative sensitivity, providing a more comfortable experience for patients. Its ethanol/water solvent system optimally loads the adhesive with fillers (15%), further enhancing its properties.The Bond Plus Se adhesive is a seventh-generation bonding agent, eliminating the need for separate etchants or primers. By applying the adhesive directly, light curing, and proceeding with the composite restorative material, the process is streamlined and efficient. The material is also HEMA free, ensuring excellent biocompatibility.

Typical Strenght:

• Enamel: 26.4MPa (shear bond strength @ 24 hours)
• Dentine: 27.8Mpa (shear bond strength @ 24 hours)

• 1 x 5 ml bottle